From owner-freebsd-questions@FreeBSD.ORG Tue Oct 7 23:40:53 2008 Return-Path: Delivered-To: freebsd-questions@FreeBSD.org Received: from mx1.freebsd.org (mx1.freebsd.org [IPv6:2001:4f8:fff6::34]) by hub.freebsd.org (Postfix) with ESMTP id 692491065689 for ; Tue, 7 Oct 2008 23:40:53 +0000 (UTC) (envelope-from walt@wump.org) Received: from que31.charter.net (que31.charter.net [209.225.8.23]) by mx1.freebsd.org (Postfix) with ESMTP id F1B9A8FC20 for ; Tue, 7 Oct 2008 23:40:52 +0000 (UTC) (envelope-from walt@wump.org) Received: from aarprv04.charter.net ([10.20.200.74]) by mta31.charter.net (InterMail vM.7.08.03.00 201-2186-126-20070710) with ESMTP id <20081007232309.ZGXW4798.mta31.charter.net@aarprv04.charter.net> for ; Tue, 7 Oct 2008 19:23:09 -0400 Received: from [10.0.0.10] (really [68.116.98.9]) by aarprv04.charter.net with ESMTP id <20081007232309.BGIG3522.aarprv04.charter.net@[10.0.0.10]> for ; Tue, 7 Oct 2008 19:23:09 -0400 Mime-Version: 1.0 Message-Id: In-Reply-To: References: <20081007132517.GA31229@melon.esperance-linux.co.uk> <20081007132832.GA49914@icarus.home.lan> <20081007173315.GA35592@melon.esperance-linux.co.uk> <20081007175124.GA54581@icarus.home.lan> Date: Tue, 7 Oct 2008 16:23:01 -0700 To: FreeBSD Questions ML From: Walt Pawley Content-Type: text/plain; charset="us-ascii" X-Chzlrs: 0 Cc: Subject: Re: Coretemp seems to be off quite a bit X-BeenThere: freebsd-questions@freebsd.org X-Mailman-Version: 2.1.5 Precedence: list List-Id: User questions List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , X-List-Received-Date: Tue, 07 Oct 2008 23:40:53 -0000 >On Oct 7, 2008, at 12:51 PM, Jeremy Chadwick wrote: >... >I remounted the heatsink (side note: curse you, Intel - was that meant >to be funny?), and didn't apply a single bit of paste other than what >came on it. FWIW: one needs to be careful with the application of heat sink "paste" if one doesn't want to do more harm than good. A very many years ago, when I was young enough to be a practicing engineer, National Semiconductor published some notes about various component to heat sink mounting methodologies. There were two results that stood out. First, using too much heat sink compound is worse than using nothing at all. The reason is that metal to metal is quite good and the proper application of of compound should only just fill the voids where the two "flat" surfaces don't touch. Second, metal to metal is quite good - as evidenced by a very large jump in heat conductivity when the component was surface soldered to the heat sink. -- Walter M. Pawley Wump Research & Company 676 River Bend Road, Roseburg, OR 97471 541-672-8975