From owner-freebsd-acpi@FreeBSD.ORG Fri Dec 20 16:58:00 2013 Return-Path: Delivered-To: freebsd-acpi@freebsd.org Received: from mx1.freebsd.org (mx1.freebsd.org [IPv6:2001:1900:2254:206a::19:1]) (using TLSv1 with cipher ADH-AES256-SHA (256/256 bits)) (No client certificate requested) by hub.freebsd.org (Postfix) with ESMTPS id D73FCE3 for ; Fri, 20 Dec 2013 16:58:00 +0000 (UTC) Received: from frontend3.warwick.net (mx1.warwick.net [204.255.24.104]) by mx1.freebsd.org (Postfix) with SMTP id 887C1155F for ; Fri, 20 Dec 2013 16:58:00 +0000 (UTC) Received: (qmail 4425 invoked from network); 20 Dec 2013 16:57:58 -0000 Received: from 70.44.113.171.res-cmts.sefg.ptd.net (HELO [70.44.113.171]) (egunther@warwick.net@70.44.113.171) by frontend3.warwick.net with SMTP (e0c2215a-6997-11e3-8372-0019bb38a71e); Fri, 20 Dec 2013 11:57:58 -0500 Message-ID: <1387558678.2579.10.camel@res-cmts> Subject: info for hp pavilion ze2000 From: ito To: freebsd-acpi@freebsd.org Date: Fri, 20 Dec 2013 11:57:58 -0500 Content-Type: multipart/mixed; boundary="=-KmgJHTYRs28fZoBMi/KQ" X-Mailer: Evolution 3.6.4 Mime-Version: 1.0 X-MagicMail-UUID: e0c2215a-6997-11e3-8372-0019bb38a71e X-MagicMail-Authenticated: egunther@warwick.net X-BeenThere: freebsd-acpi@freebsd.org X-Mailman-Version: 2.1.17 Precedence: list List-Id: ACPI and power management development List-Unsubscribe: , List-Archive: List-Post: List-Help: List-Subscribe: , X-List-Received-Date: Fri, 20 Dec 2013 16:58:01 -0000 --=-KmgJHTYRs28fZoBMi/KQ Content-Type: text/plain; charset="UTF-8" Content-Transfer-Encoding: 7bit Hello, This is all the information I could find so far. thanks, eg Attached txt file for further specs from intel website. Below from hp partsurfer. hp part# Intel Celeron M 360 (1.4-GHz) with 400-MHz FSB 380033-001 Intel Celeron M 350 (1.3-GHz) with 400-MHz FSB 380032-001 System boards For use on models with full-featured models 381062-001 For use on models with defeatured models 381061-001 38033-001 Intel Celeron M processor 360 - 1.40GHz (Dothan, 400MHz front side bus, 512KB Level-2 cache, PPGA FC-PGA2, 478-pin, 130nm) 380032-001 Intel Celeron M processor 350 - 1.30GHz (Dothan, 400MHz front side bus, 512KB Level-2 cache, PPGA FC-PGA2, 478-pin, 130nm) 381062-001 Motherboard with Centrino technology (Full-Featured) - Includes the Intel 855 chipset, 400MHz FSB, Intel Extreme Graphics 2, up to 64MB video memory - Rev. B 381061-001 Motherboard with Centrino technology - Includes the Intel 852GM chipset with 400MHz processor side bus and integrated Intel Extreme Graphics with up to 64MB video memory --=-KmgJHTYRs28fZoBMi/KQ Content-Disposition: attachment; filename="pavilion_ze_internals.txt" Content-Type: text/plain; name="pavilion_ze_internals.txt"; charset="UTF-8" Content-Transfer-Encoding: 8bit SPECIFICATIONS---------------------------------below Intel® Celeron® M Processor 350----------------------- (1M Cache, 1.30 GHz, 400 MHz FSB) ----------------------------------- Essentials Status Launched Processor Number 350 # of Cores 1 Clock Speed 1.3 GHz L2 Cache 1 MB FSB Speed 400 MHz FSB Parity No Instruction Set 32-bit Embedded Options Available No Lithography 90 nm Max TDP 21 W Scenario Design Power (SDP) 0 W VID Voltage Range 1.260V Recommended Customer Price N/A Memory Specifications Physical Address Extensions 32-bit ECC Memory Supported ‡ No Package Specifications TJUNCTION 100°C Package Size 35mm x 35mm Processing Die Size 87 mm2 # of Processing Die Transistors 144 million Sockets Supported H-PBGA478, H-PBGA479, PPGA478, PPGA479 Low Halogen Options Available See MDDS Advanced Technologies Intel® Turbo Boost Technology ‡ No Intel® Hyper-Threading Technology ‡ No Intel® Virtualization Technology (VT-x) ‡ No Intel® 64 ‡ No Idle States No Enhanced Intel SpeedStep® Technology No Intel® Demand Based Switching No Intel® Platform Protection Technology Trusted Execution Technology ‡ No Execute Disable Bit ‡ Yes SPECIFICATIONS--------------------------------- Intel® Celeron® M Processor 350----------------------- (1M Cache, 1.30 GHz, 400 MHz FSB) ----------------------------------------- --------------------------- ------------------ ----------------- ---------- SPECIFICATIONS-----------------------------below Intel® Celeron® M Processor 360--------------------------- (1M Cache, 1.40 GHz, 400 MHz FSB) -------------------------------------------- Essentials Status Launched Processor Number 360 # of Cores 1 Clock Speed 1.4 GHz L2 Cache 1 MB FSB Speed 400 MHz FSB Parity No Instruction Set 32-bit Embedded Options Available No Lithography 90 nm Max TDP 21 W Scenario Design Power (SDP) 0 W VID Voltage Range 1.260V, 1.004V-1.292V Recommended Customer Price N/A Package Specifications TJUNCTION 100°C Package Size 35mm x 35mm Processing Die Size 87 mm2 # of Processing Die Transistors 144 million Sockets Supported H-PBGA479, PPGA478 Low Halogen Options Available See MDDS Advanced Technologies Intel® Turbo Boost Technology ‡ No Intel® Hyper-Threading Technology ‡ No Intel® Virtualization Technology (VT-x) ‡ No Intel® 64 ‡ No Idle States No Enhanced Intel SpeedStep® Technology No Intel® Demand Based Switching No Intel® Platform Protection Technology Trusted Execution Technology ‡ No Execute Disable Bit ‡ Yes SPECIFICATIONS----------------------------- Intel® Celeron® M Processor 360--------------------------- (1M Cache, 1.40 GHz, 400 MHz FSB) -------------------------------------------- ------------- --------- ---------- ----------------------- SPECIFICATIONS----------------------------------------------------below Mobile Intel® 855GME Chipset--------------------------------------------- (Intel® 82855GME Graphics and Memory Controller) -------------------------------------------------------------- Essentials Status End of Life Launch Date Q4'03 Supported FSBs 400MHz FSB Parity No Embedded Options Available Yes Max TDP 4.3 W Recommended Customer Price T&R : $22.00 Memory Specifications Max Memory Size (dependent on memory type) 2 GB Memory Types DDR-200 / DDR-266 / DDR-333 # of Memory Channels 1 Max Memory Bandwidth 2.7 GB/s Physical Address Extensions 32-bit ECC Memory Supported ‡ Yes Graphics Specifications Integrated Graphics ‡ Yes Graphics Output VGA, LVDS, DVO Intel® Clear Video Technology No Macrovision* License Required No Expansion Options PCI Express Revision 1.1 Package Specifications Max CPU Configuration 1 TCASE 105°C Package Size 37.5mm x 37.5mm Low Halogen Options Available See MDDS Advanced Technologies Intel® Fast Memory Access No Intel® Flex Memory Access No SPECIFICATIONS--------------------------------------------------- Mobile Intel® 855GME Chipset--------------------------------------------- (Intel® 82855GME Graphics and Memory Controller) -------------------------------------------------------------- ------------------------ --------------------------- ------------------ ---------------- SPECIFICATIONS--------------------------below----- ---------------------------------------------- ------------------------- Mobile Intel® 855GM Chipset------------------------------------- (Intel® 82855GM Graphics and Memory Controller)- ---------- Essentials Status End of Life Supported FSBs 400MHz FSB Parity No Embedded Options Available No Max TDP 3.2 W Recommended Customer Price N/A Memory Specifications Max Memory Size (dependent on memory type) 2 GB Memory Types DDR-200 / DDR-266 # of Memory Channels 1 Max Memory Bandwidth 2.1 GB/s Physical Address Extensions 32-bit ECC Memory Supported ‡ Yes Graphics Specifications Integrated Graphics ‡ Yes Graphics Output VGA, LVDS, DVO Intel® Clear Video Technology No Macrovision* License Required No Expansion Options PCI Express Revision 1.1 Package Specifications Max CPU Configuration 1 TCASE 105°C Package Size 37.5mm x 37.5mm Low Halogen Options Available See MDDS Advanced Technologies Intel® Fast Memory Access No Intel® Flex Memory Access No SPECIFICATIONS------------------------- ---------------------------------------------- ------------------------- Mobile Intel® 855GM Chipset------------------------------------- (Intel® 82855GM Graphics and Memory Controller)- ---------- SPECIFICATIONS--------below------------------------------------ Mobile Intel® 852GM Chipset-------------------------------------- (Intel® 82852GM Graphics and Memory Controller)----- -------------- Essentials Status End of Life Launch Date Q2'04 Supported FSBs 400MHz FSB Parity No Embedded Options Available Yes Max TDP 3.2 W Recommended Customer Price N/A Memory Specifications Max Memory Size (dependent on memory type) 2 GB Memory Types DDR-200 / DDR-266 # of Memory Channels 1 Max Memory Bandwidth 2.1 GB/s Physical Address Extensions 32-bit ECC Memory Supported ‡ No Graphics Specifications Integrated Graphics ‡ Yes Graphics Output VGA, LVDS, DVO Intel® Clear Video Technology No Macrovision* License Required No Expansion Options PCI Express Revision 1.1 Package Specifications Max CPU Configuration 1 Package Size 37.5mm x 37.5mm Low Halogen Options Available See MDDS Advanced Technologies Intel® Fast Memory Access No Intel® Flex Memory Access No SPECIFICATIONS-------------------------------------------- Mobile Intel® 852GM Chipset-------------------------------------- (Intel® 82852GM Graphics and Memory Controller)----- -------------- SPECIFICATIONS------------below---------------------- Mobile Intel® 852GME Chipset------------------------------- (Intel® 82852GME Graphics and Memory Controller)----- --------------------------- Essentials Status End of Life Launch Date Q4'03 Supported FSBs 533MHz FSB Parity No Embedded Options Available Yes Max TDP 5.7 W Recommended Customer Price N/A Memory Specifications Max Memory Size (dependent on memory type) 2 GB Memory Types DDR-200 / DDR-266 / DDR-333 # of Memory Channels 1 Max Memory Bandwidth 2.7 GB/s Physical Address Extensions 32-bit ECC Memory Supported ‡ Yes Graphics Specifications Integrated Graphics ‡ Yes Graphics Output VGA, LVDS, DVO Intel® Clear Video Technology No Macrovision* License Required No Expansion Options PCI Express Revision 1.1 Package Specifications Max CPU Configuration 1 TCASE 110°C Package Size 37.5mm x 37.5mm Low Halogen Options Available See MDDS Advanced Technologies Intel® Fast Memory Access No Intel® Flex Memory Access No SPECIFICATIONS---------------------------------- Mobile Intel® 852GME Chipset------------------------------- (Intel® 82852GME Graphics and Memory Controller)----- --------------------------- SPECIFICATIONS---------------below----------------- Mobile Intel® 852PM Chipset------------------------------- (Intel® 82852PM Memory Controller)-------- ---------------- Essentials Status End of Life Supported FSBs 533MHz FSB Parity No Embedded Options Available No Max TDP 5.7 W Recommended Customer Price N/A Memory Specifications Max Memory Size (dependent on memory type) 2 GB Memory Types DDR-200 / DDR-266 / DDR-333 # of Memory Channels 1 Max Memory Bandwidth 2.7 GB/s Physical Address Extensions 32-bit ECC Memory Supported ‡ Yes Graphics Specifications Integrated Graphics ‡ No Graphics Output None Intel® Clear Video Technology No Macrovision* License Required No Expansion Options PCI Express Revision 1.1 Package Specifications Max CPU Configuration 1 TCASE 110°C Package Size 37.5mm x 37.5mm Low Halogen Options Available See MDDS Advanced Technologies Intel® Fast Memory Access No Intel® Flex Memory Access No SPECIFICATIONS-------------------------------- Mobile Intel® 852PM Chipset------------------------------- (Intel® 82852PM Memory Controller)-------- ---------------- SPECIFICATIONS--------------below------------------------------------ Mobile Intel® 852GMV Chipset---------------------------------------- (Intel® 82852GMV Graphics and Memory Controller)------- --------------------- Essentials Status End of Life Supported FSBs 533MHz FSB Parity No Embedded Options Available No Max TDP 3.2 W Recommended Customer Price N/A Memory Specifications Max Memory Size (dependent on memory type) 2 GB Memory Types DDR-200 / DDR-266 # of Memory Channels 1 Max Memory Bandwidth 2.1 GB/s Physical Address Extensions 32-bit ECC Memory Supported ‡ No Graphics Specifications Integrated Graphics ‡ Yes Graphics Output VGA, LVDS, DVO Intel® Clear Video Technology No Macrovision* License Required No Expansion Options PCI Express Revision 1.1 Package Specifications Max CPU Configuration 1 Package Size 37.5mm x 37.5mm Low Halogen Options Available See MDDS Advanced Technologies Intel® Fast Memory Access No Intel® Flex Memory Access No SPECIFICATIONS-------------------------------------------------- Mobile Intel® 852GMV Chipset---------------------------------------- (Intel® 82852GMV Graphics and Memory Controller)------- --------------------- --=-KmgJHTYRs28fZoBMi/KQ--