Date: Fri, 14 Dec 2018 09:43:49 +0100 From: Marcin Wojtas <mw@semihalf.com> To: manu@freebsd.org Cc: src-committers <src-committers@freebsd.org>, svn-src-all@freebsd.org, svn-src-head@freebsd.org Subject: Re: svn commit: r342020 - in head/sys: arm/mv arm64/conf conf Message-ID: <CAPv3WKewZeU9ZsnKw-cKqPFYsjF2BCkw2M1j2wz=X77ZpeME2Q@mail.gmail.com> In-Reply-To: <201812122233.wBCMX5hg025508@repo.freebsd.org> References: <201812122233.wBCMX5hg025508@repo.freebsd.org>
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Hi Manu, Imo the new driver is adding code duplication - please check sys/arm/mv/armada/thermal.c. It contains support for armada38x (which has BTW exactly same coefficients as CP110). Basically it would be enough to add 2 structures for ap806 and cp110. Best regards, Marcin=C5=9Br., 12 gru 2018 o 23:33 Emmanuel Vadot <manu@freebsd.org> napis= a=C5=82(a): > > Author: manu > Date: Wed Dec 12 22:33:05 2018 > New Revision: 342020 > URL: https://svnweb.freebsd.org/changeset/base/342020 > > Log: > mv_thermal: Add thermal driver for AP806 and CP110 thermal sensor > > Sponsored by: Rubicon Communications, LLC ("Netgate") > > Added: > head/sys/arm/mv/mv_thermal.c (contents, props changed) > Modified: > head/sys/arm64/conf/GENERIC > head/sys/conf/files.arm64 > > Added: head/sys/arm/mv/mv_thermal.c > =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D > --- /dev/null 00:00:00 1970 (empty, because file is newly added) > +++ head/sys/arm/mv/mv_thermal.c Wed Dec 12 22:33:05 2018 (= r342020) > @@ -0,0 +1,381 @@ > +/*- > + * SPDX-License-Identifier: BSD-2-Clause-FreeBSD > + * > + * Copyright (c) 2018 Rubicon Communications, LLC (Netgate) > + * > + * Redistribution and use in source and binary forms, with or without > + * modification, are permitted provided that the following conditions > + * are met: > + * 1. Redistributions of source code must retain the above copyright > + * notice, this list of conditions and the following disclaimer. > + * 2. Redistributions in binary form must reproduce the above copyright > + * notice, this list of conditions and the following disclaimer in th= e > + * documentation and/or other materials provided with the distributio= n. > + * > + * THIS SOFTWARE IS PROVIDED BY THE AUTHOR AND CONTRIBUTORS ``AS IS'' AN= D > + * ANY EXPRESS OR IMPLIED WARRANTIES, INCLUDING, BUT NOT LIMITED TO, THE > + * IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PU= RPOSE > + * ARE DISCLAIMED. IN NO EVENT SHALL THE AUTHOR OR CONTRIBUTORS BE LIAB= LE > + * FOR ANY DIRECT, INDIRECT, INCIDENTAL, SPECIAL, EXEMPLARY, OR CONSEQUE= NTIAL > + * DAMAGES (INCLUDING, BUT NOT LIMITED TO, PROCUREMENT OF SUBSTITUTE GOO= DS > + * OR SERVICES; LOSS OF USE, DATA, OR PROFITS; OR BUSINESS INTERRUPTION) > + * HOWEVER CAUSED AND ON ANY THEORY OF LIABILITY, WHETHER IN CONTRACT, S= TRICT > + * LIABILITY, OR TORT (INCLUDING NEGLIGENCE OR OTHERWISE) ARISING IN ANY= WAY > + * OUT OF THE USE OF THIS SOFTWARE, EVEN IF ADVISED OF THE POSSIBILITY O= F > + * SUCH DAMAGE. > + * > + * $FreeBSD$ > + */ > + > +#include <sys/cdefs.h> > +__FBSDID("$FreeBSD$"); > + > +#include <sys/param.h> > +#include <sys/systm.h> > +#include <sys/bus.h> > + > +#include <sys/kernel.h> > +#include <sys/module.h> > +#include <sys/rman.h> > +#include <sys/lock.h> > +#include <sys/mutex.h> > +#include <sys/sysctl.h> > + > +#include <machine/bus.h> > +#include <machine/resource.h> > +#include <machine/intr.h> > + > +#include <dev/fdt/simplebus.h> > + > +#include <dev/ofw/ofw_bus.h> > +#include <dev/ofw/ofw_bus_subr.h> > + > +#define CONTROL0 0x00 > +#define CONTROL0_TSEN_START (1 << 0) > +#define CONTROL0_TSEN_RESET (1 << 1) > +#define CONTROL0_TSEN_EN (1 << 2) > +#define CONTROL0_CHANNEL_SHIFT 13 > +#define CONTROL0_CHANNEL_MASK 0xF > +#define CONTROL0_OSR_SHIFT 24 > +#define CONTROL0_OSR_MAX 3 /* OSR =3D 512 * 4uS =3D = ~2mS */ > +#define CONTROL0_MODE_SHIFT 30 > +#define CONTROL0_MODE_EXTERNAL 0x2 > +#define CONTROL0_MODE_MASK 0x3 > + > +#define CONTROL1 0x04 > +/* This doesn't seems to work */ > +#define CONTROL1_TSEN_SENS_SHIFT 21 > +#define CONTROL1_TSEN_SENS_MASK 0x7 > + > +#define STATUS 0x00 > +#define STATUS_TEMP_MASK 0x3FF > + > +enum mv_thermal_type { > + MV_AP806 =3D 1, > + MV_CP110, > +}; > + > +struct mv_thermal_config { > + enum mv_thermal_type type; > + int ncpus; > + int64_t calib_mul; > + int64_t calib_add; > + int64_t calib_div; > + uint32_t valid_mask; > + bool signed_value; > +}; > + > +struct mv_thermal_softc { > + device_t dev; > + struct resource *res[2]; > + struct mtx mtx; > + > + struct mv_thermal_config *config; > + int cur_sensor; > +}; > + > +static struct mv_thermal_config mv_ap806_config =3D { > + .type =3D MV_AP806, > + .ncpus =3D 4, > + .calib_mul =3D 423, > + .calib_add =3D -150000, > + .calib_div =3D 100, > + .valid_mask =3D (1 << 16), > + .signed_value =3D true, > +}; > + > +static struct mv_thermal_config mv_cp110_config =3D { > + .type =3D MV_CP110, > + .calib_mul =3D 2000096, > + .calib_add =3D 1172499100, > + .calib_div =3D 420100, > + .valid_mask =3D (1 << 10), > + .signed_value =3D false, > +}; > + > +static struct resource_spec mv_thermal_res_spec[] =3D { > + { SYS_RES_MEMORY, 0, RF_ACTIVE }, > + { SYS_RES_MEMORY, 1, RF_ACTIVE }, > + { -1, 0 } > +}; > + > +static struct ofw_compat_data compat_data[] =3D { > + {"marvell,armada-ap806-thermal", (uintptr_t) &mv_ap806_config}, > + {"marvell,armada-cp110-thermal", (uintptr_t) &mv_cp110_config}, > + {NULL, 0} > +}; > + > +#define RD_STA(sc, reg) bus_read_4((sc)->res[0], (reg)) > +#define WR_STA(sc, reg, val) bus_write_4((sc)->res[0], (reg), = (val)) > +#define RD_CON(sc, reg) bus_read_4((sc)->res[1], (reg)) > +#define WR_CON(sc, reg, val) bus_write_4((sc)->res[1], (reg), = (val)) > + > +static inline int32_t sign_extend(uint32_t value, int index) > +{ > + uint8_t shift; > + > + shift =3D 31 - index; > + return ((int32_t)(value << shift) >> shift); > +} > + > +static int > +mv_thermal_wait_sensor(struct mv_thermal_softc *sc) > +{ > + uint32_t reg; > + uint32_t timeout; > + > + timeout =3D 100000; > + while (--timeout > 0) { > + reg =3D RD_STA(sc, STATUS); > + if ((reg & sc->config->valid_mask) =3D=3D sc->config->val= id_mask) > + break; > + DELAY(100); > + } > + if (timeout =3D=3D 0) { > + return (ETIMEDOUT); > + } > + > + return (0); > +} > + > +static int > +mv_thermal_select_sensor(struct mv_thermal_softc *sc, int sensor) > +{ > + uint32_t reg; > + > + if (sc->cur_sensor =3D=3D sensor) > + return (0); > + > + /* Stop the current reading and reset the module */ > + reg =3D RD_CON(sc, CONTROL0); > + reg &=3D ~(CONTROL0_TSEN_START | CONTROL0_TSEN_EN); > + WR_CON(sc, CONTROL0, reg); > + > + /* Switch to the selected sensor */ > + /* > + * NOTE : Datasheet says to use CONTROL1 for selecting > + * but when doing so the sensors >0 are never ready > + * Do what Linux does using undocumented bits in CONTROL0 > + */ > + /* This reset automatically to the sensor 0 */ > + reg &=3D ~(CONTROL0_MODE_MASK << CONTROL0_MODE_SHIFT); > + if (sensor) { > + /* Select external sensor */ > + reg |=3D CONTROL0_MODE_EXTERNAL << CONTROL0_MODE_SHIFT; > + reg &=3D ~(CONTROL0_CHANNEL_MASK << CONTROL0_CHANNEL_SHIF= T); > + reg |=3D (sensor - 1) << CONTROL0_CHANNEL_SHIFT; > + } > + WR_CON(sc, CONTROL0, reg); > + sc->cur_sensor =3D sensor; > + > + /* Start the reading */ > + reg =3D RD_CON(sc, CONTROL0); > + reg |=3D CONTROL0_TSEN_START | CONTROL0_TSEN_EN; > + WR_CON(sc, CONTROL0, reg); > + > + return (mv_thermal_wait_sensor(sc)); > +} > + > +static int > +mv_thermal_read_sensor(struct mv_thermal_softc *sc, int sensor, int *tem= p) > +{ > + uint32_t reg; > + int64_t sample, rv; > + > + rv =3D mv_thermal_select_sensor(sc, sensor); > + if (rv !=3D 0) > + return (rv); > + > + reg =3D RD_STA(sc, STATUS) & STATUS_TEMP_MASK; > + > + if (sc->config->signed_value) > + sample =3D sign_extend(reg, fls(STATUS_TEMP_MASK) - 1); > + else > + sample =3D reg; > + > + *temp =3D ((sample * sc->config->calib_mul) - sc->config->calib_a= dd) / > + sc->config->calib_div; > + > + return (0); > +} > + > +static int > +ap806_init(struct mv_thermal_softc *sc) > +{ > + uint32_t reg; > + > + /* Start the temp capture/conversion */ > + reg =3D RD_CON(sc, CONTROL0); > + reg &=3D ~CONTROL0_TSEN_RESET; > + reg |=3D CONTROL0_TSEN_START | CONTROL0_TSEN_EN; > + > + /* Sample every ~2ms */ > + reg |=3D CONTROL0_OSR_MAX << CONTROL0_OSR_SHIFT; > + > + WR_CON(sc, CONTROL0, reg); > + > + /* Since we just started the module wait for the sensor to be rea= dy */ > + mv_thermal_wait_sensor(sc); > + > + return (0); > +} > + > +static int > +cp110_init(struct mv_thermal_softc *sc) > +{ > + uint32_t reg; > + > + reg =3D RD_CON(sc, CONTROL1); > + reg &=3D (1 << 7); > + reg |=3D (1 << 8); > + WR_CON(sc, CONTROL1, reg); > + > + /* Sample every ~2ms */ > + reg =3D RD_CON(sc, CONTROL0); > + reg |=3D CONTROL0_OSR_MAX << CONTROL0_OSR_SHIFT; > + WR_CON(sc, CONTROL0, reg); > + > + return (0); > +} > + > +static int > +mv_thermal_sysctl(SYSCTL_HANDLER_ARGS) > +{ > + struct mv_thermal_softc *sc; > + device_t dev =3D arg1; > + int sensor =3D arg2; > + int val =3D 0; > + > + sc =3D device_get_softc(dev); > + mtx_lock(&(sc)->mtx); > + > + if (mv_thermal_read_sensor(sc, sensor, &val) =3D=3D 0) { > + /* Convert to Kelvin */ > + val =3D val + 2732; > + } else { > + device_printf(dev, "Timeout waiting for sensor\n"); > + } > + > + mtx_unlock(&(sc)->mtx); > + return sysctl_handle_opaque(oidp, &val, sizeof(val), req); > +} > + > +static int > +mv_thermal_probe(device_t dev) > +{ > + > + if (!ofw_bus_status_okay(dev)) > + return (ENXIO); > + > + if (ofw_bus_search_compatible(dev, compat_data)->ocd_data =3D=3D = 0) > + return (ENXIO); > + > + device_set_desc(dev, "Marvell Thermal Sensor Controller"); > + return (BUS_PROBE_DEFAULT); > +} > + > +static int > +mv_thermal_attach(device_t dev) > +{ > + struct mv_thermal_softc *sc; > + struct sysctl_ctx_list *ctx; > + struct sysctl_oid_list *oid; > + char name[255]; > + char desc[255]; > + int i; > + > + sc =3D device_get_softc(dev); > + sc->dev =3D dev; > + > + sc->config =3D (struct mv_thermal_config *)ofw_bus_search_compati= ble(dev, compat_data)->ocd_data; > + > + mtx_init(&sc->mtx, device_get_nameunit(dev), NULL, MTX_DEF); > + > + if (bus_alloc_resources(dev, mv_thermal_res_spec, sc->res) !=3D 0= ) { > + device_printf(dev, "cannot allocate resources for device\= n"); > + return (ENXIO); > + } > + > + sc->cur_sensor =3D -1; > + switch (sc->config->type) { > + case MV_AP806: > + ap806_init(sc); > + break; > + case MV_CP110: > + cp110_init(sc); > + break; > + } > + > + ctx =3D device_get_sysctl_ctx(dev); > + oid =3D SYSCTL_CHILDREN(device_get_sysctl_tree(dev)); > + /* There is always at least one sensor */ > + SYSCTL_ADD_PROC(ctx, oid, OID_AUTO, "internal", > + CTLTYPE_INT | CTLFLAG_RD, > + dev, 0, mv_thermal_sysctl, > + "IK", > + "Internal Temperature"); > + > + for (i =3D 0; i < sc->config->ncpus; i++) { > + snprintf(name, sizeof(name), "cpu%d", i); > + snprintf(desc, sizeof(desc), "CPU%d Temperature", i); > + SYSCTL_ADD_PROC(ctx, oid, OID_AUTO, name, > + CTLTYPE_INT | CTLFLAG_RD, > + dev, i + 1, mv_thermal_sysctl, > + "IK", > + desc); > + } > + > + return (0); > +} > + > +static int > +mv_thermal_detach(device_t dev) > +{ > + struct mv_thermal_softc *sc; > + > + sc =3D device_get_softc(dev); > + > + bus_release_resources(dev, mv_thermal_res_spec, sc->res); > + > + return (0); > +} > + > +static device_method_t mv_thermal_methods[] =3D { > + /* Device interface */ > + DEVMETHOD(device_probe, mv_thermal_probe), > + DEVMETHOD(device_attach, mv_thermal_attach), > + DEVMETHOD(device_detach, mv_thermal_detach), > + > + DEVMETHOD_END > +}; > + > +static devclass_t mv_thermal_devclass; > + > +static driver_t mv_thermal_driver =3D { > + "mv_thermal", > + mv_thermal_methods, > + sizeof(struct mv_thermal_softc), > +}; > + > +DRIVER_MODULE(mv_thermal, simplebus, mv_thermal_driver, > + mv_thermal_devclass, 0, 0); > > Modified: head/sys/arm64/conf/GENERIC > =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D > --- head/sys/arm64/conf/GENERIC Wed Dec 12 22:24:30 2018 (r342019) > +++ head/sys/arm64/conf/GENERIC Wed Dec 12 22:33:05 2018 (r342020) > @@ -240,6 +240,7 @@ device aw_sid # Allwinner Secur= e ID EFUSE > > # Thermal sensors > device aw_thermal # Allwinner Thermal Sensor Controller > +device mv_thermal # Marvell Thermal Sensor Controller > > # SPI > device spibus > > Modified: head/sys/conf/files.arm64 > =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D= =3D=3D=3D=3D > --- head/sys/conf/files.arm64 Wed Dec 12 22:24:30 2018 (r342019) > +++ head/sys/conf/files.arm64 Wed Dec 12 22:33:05 2018 (r342020) > @@ -95,6 +95,7 @@ arm/mv/mv_cp110_icu.c optional = mv_cp110_icu fdt > arm/mv/mv_ap806_gicp.c optional mv_ap806_gicp fd= t > arm/mv/mv_ap806_clock.c optional SOC_MARV= ELL_8K fdt > arm/mv/mv_cp110_clock.c optional SOC_MARV= ELL_8K fdt > +arm/mv/mv_thermal.c optional SOC_MARVELL_8K m= v_thermal fdt > arm/mv/armada38x/armada38x_rtc.c optional mv_rtc fdt > arm/xilinx/uart_dev_cdnc.c optional uart soc_xilinx_= zynq > arm64/acpica/acpi_machdep.c optional acpi >
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