Date: Fri, 20 Dec 2013 11:57:58 -0500 From: ito <egunther@warwick.net> To: freebsd-acpi@freebsd.org Subject: info for hp pavilion ze2000 Message-ID: <1387558678.2579.10.camel@res-cmts>
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Hello,
This is all the information I could find so far.
thanks,
eg
Attached txt file for further specs from intel website.
Below from hp partsurfer.
hp part#
Intel Celeron M 360 (1.4-GHz) with 400-MHz FSB 380033-001
Intel Celeron M 350 (1.3-GHz) with 400-MHz FSB 380032-001
System boards
For use on models with full-featured models 381062-001
For use on models with defeatured models 381061-001
38033-001
Intel Celeron M processor 360 - 1.40GHz (Dothan, 400MHz front side bus,
512KB Level-2 cache, PPGA FC-PGA2, 478-pin, 130nm)
380032-001
Intel Celeron M processor 350 - 1.30GHz (Dothan, 400MHz front side bus,
512KB Level-2 cache, PPGA FC-PGA2, 478-pin, 130nm)
381062-001
Motherboard with Centrino technology (Full-Featured) - Includes the
Intel 855 chipset, 400MHz FSB, Intel Extreme Graphics 2, up to 64MB
video memory - Rev. B
381061-001
Motherboard with Centrino technology - Includes the Intel 852GM chipset
with 400MHz processor side bus and integrated Intel Extreme Graphics
with up to 64MB video memory
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SPECIFICATIONS---------------------------------below
Intel® Celeron® M Processor 350-----------------------
(1M Cache, 1.30 GHz, 400 MHz FSB)
-----------------------------------
Essentials
Status Launched
Processor Number 350
# of Cores 1
Clock Speed 1.3 GHz
L2 Cache 1 MB
FSB Speed 400 MHz
FSB Parity No
Instruction Set 32-bit
Embedded Options Available
No
Lithography 90 nm
Max TDP 21 W
Scenario Design Power (SDP) 0 W
VID Voltage Range 1.260V
Recommended Customer Price N/A
Memory Specifications
Physical Address Extensions 32-bit
ECC Memory Supported ‡
No
Package Specifications
TJUNCTION 100°C
Package Size 35mm x 35mm
Processing Die Size 87 mm2
# of Processing Die Transistors 144 million
Sockets Supported H-PBGA478, H-PBGA479, PPGA478, PPGA479
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® Hyper-Threading Technology ‡
No
Intel® Virtualization Technology (VT-x) ‡
No
Intel® 64 ‡
No
Idle States No
Enhanced Intel SpeedStep® Technology
No
Intel® Demand Based Switching
No
Intel® Platform Protection Technology
Trusted Execution Technology ‡
No
Execute Disable Bit ‡ Yes
SPECIFICATIONS---------------------------------
Intel® Celeron® M Processor 350-----------------------
(1M Cache, 1.30 GHz, 400 MHz FSB)
-----------------------------------------
---------------------------
------------------
-----------------
----------
SPECIFICATIONS-----------------------------below
Intel® Celeron® M Processor 360---------------------------
(1M Cache, 1.40 GHz, 400 MHz FSB)
--------------------------------------------
Essentials
Status Launched
Processor Number 360
# of Cores 1
Clock Speed 1.4 GHz
L2 Cache 1 MB
FSB Speed 400 MHz
FSB Parity No
Instruction Set 32-bit
Embedded Options Available
No
Lithography 90 nm
Max TDP 21 W
Scenario Design Power (SDP) 0 W
VID Voltage Range 1.260V, 1.004V-1.292V
Recommended Customer Price N/A
Package Specifications
TJUNCTION 100°C
Package Size 35mm x 35mm
Processing Die Size 87 mm2
# of Processing Die Transistors 144 million
Sockets Supported H-PBGA479, PPGA478
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Turbo Boost Technology ‡ No
Intel® Hyper-Threading Technology ‡
No
Intel® Virtualization Technology (VT-x) ‡
No
Intel® 64 ‡
No
Idle States No
Enhanced Intel SpeedStep® Technology
No
Intel® Demand Based Switching
No
Intel® Platform Protection Technology
Trusted Execution Technology ‡
No
Execute Disable Bit ‡ Yes
SPECIFICATIONS-----------------------------
Intel® Celeron® M Processor 360---------------------------
(1M Cache, 1.40 GHz, 400 MHz FSB)
--------------------------------------------
-------------
---------
----------
-----------------------
SPECIFICATIONS----------------------------------------------------below
Mobile Intel® 855GME Chipset---------------------------------------------
(Intel® 82855GME Graphics and Memory Controller)
--------------------------------------------------------------
Essentials
Status End of Life
Launch Date Q4'03
Supported FSBs 400MHz
FSB Parity No
Embedded Options Available Yes
Max TDP 4.3 W
Recommended Customer Price T&R : $22.00
Memory Specifications
Max Memory Size (dependent on memory type) 2 GB
Memory Types DDR-200 / DDR-266 / DDR-333
# of Memory Channels 1
Max Memory Bandwidth 2.7 GB/s
Physical Address Extensions 32-bit
ECC Memory Supported ‡ Yes
Graphics Specifications
Integrated Graphics ‡ Yes
Graphics Output VGA, LVDS, DVO
Intel® Clear Video Technology No
Macrovision* License Required No
Expansion Options
PCI Express Revision 1.1
Package Specifications
Max CPU Configuration 1
TCASE 105°C
Package Size 37.5mm x 37.5mm
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Fast Memory Access No
Intel® Flex Memory Access No
SPECIFICATIONS---------------------------------------------------
Mobile Intel® 855GME Chipset---------------------------------------------
(Intel® 82855GME Graphics and Memory Controller)
--------------------------------------------------------------
------------------------
---------------------------
------------------
----------------
SPECIFICATIONS--------------------------below-----
----------------------------------------------
-------------------------
Mobile Intel® 855GM Chipset-------------------------------------
(Intel® 82855GM Graphics and Memory Controller)-
----------
Essentials
Status End of Life
Supported FSBs 400MHz
FSB Parity No
Embedded Options Available No
Max TDP 3.2 W
Recommended Customer Price N/A
Memory Specifications
Max Memory Size (dependent on memory type) 2 GB
Memory Types DDR-200 / DDR-266
# of Memory Channels 1
Max Memory Bandwidth 2.1 GB/s
Physical Address Extensions 32-bit
ECC Memory Supported ‡ Yes
Graphics Specifications
Integrated Graphics ‡ Yes
Graphics Output VGA, LVDS, DVO
Intel® Clear Video Technology No
Macrovision* License Required No
Expansion Options
PCI Express Revision 1.1
Package Specifications
Max CPU Configuration 1
TCASE 105°C
Package Size 37.5mm x 37.5mm
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Fast Memory Access No
Intel® Flex Memory Access No
SPECIFICATIONS-------------------------
----------------------------------------------
-------------------------
Mobile Intel® 855GM Chipset-------------------------------------
(Intel® 82855GM Graphics and Memory Controller)-
----------
SPECIFICATIONS--------below------------------------------------
Mobile Intel® 852GM Chipset--------------------------------------
(Intel® 82852GM Graphics and Memory Controller)-----
--------------
Essentials
Status End of Life
Launch Date Q2'04
Supported FSBs 400MHz
FSB Parity No
Embedded Options Available Yes
Max TDP 3.2 W
Recommended Customer Price N/A
Memory Specifications
Max Memory Size (dependent on memory type) 2 GB
Memory Types DDR-200 / DDR-266
# of Memory Channels 1
Max Memory Bandwidth 2.1 GB/s
Physical Address Extensions 32-bit
ECC Memory Supported ‡ No
Graphics Specifications
Integrated Graphics ‡ Yes
Graphics Output VGA, LVDS, DVO
Intel® Clear Video Technology No
Macrovision* License Required No
Expansion Options
PCI Express Revision 1.1
Package Specifications
Max CPU Configuration 1
Package Size 37.5mm x 37.5mm
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Fast Memory Access No
Intel® Flex Memory Access No
SPECIFICATIONS--------------------------------------------
Mobile Intel® 852GM Chipset--------------------------------------
(Intel® 82852GM Graphics and Memory Controller)-----
--------------
SPECIFICATIONS------------below----------------------
Mobile Intel® 852GME Chipset-------------------------------
(Intel® 82852GME Graphics and Memory Controller)-----
---------------------------
Essentials
Status End of Life
Launch Date Q4'03
Supported FSBs 533MHz
FSB Parity No
Embedded Options Available Yes
Max TDP 5.7 W
Recommended Customer Price N/A
Memory Specifications
Max Memory Size (dependent on memory type) 2 GB
Memory Types DDR-200 / DDR-266 / DDR-333
# of Memory Channels 1
Max Memory Bandwidth 2.7 GB/s
Physical Address Extensions 32-bit
ECC Memory Supported ‡ Yes
Graphics Specifications
Integrated Graphics ‡ Yes
Graphics Output VGA, LVDS, DVO
Intel® Clear Video Technology No
Macrovision* License Required No
Expansion Options
PCI Express Revision 1.1
Package Specifications
Max CPU Configuration 1
TCASE 110°C
Package Size 37.5mm x 37.5mm
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Fast Memory Access No
Intel® Flex Memory Access No
SPECIFICATIONS----------------------------------
Mobile Intel® 852GME Chipset-------------------------------
(Intel® 82852GME Graphics and Memory Controller)-----
---------------------------
SPECIFICATIONS---------------below-----------------
Mobile Intel® 852PM Chipset-------------------------------
(Intel® 82852PM Memory Controller)--------
----------------
Essentials
Status End of Life
Supported FSBs 533MHz
FSB Parity No
Embedded Options Available No
Max TDP 5.7 W
Recommended Customer Price N/A
Memory Specifications
Max Memory Size (dependent on memory type) 2 GB
Memory Types DDR-200 / DDR-266 / DDR-333
# of Memory Channels 1
Max Memory Bandwidth 2.7 GB/s
Physical Address Extensions 32-bit
ECC Memory Supported ‡ Yes
Graphics Specifications
Integrated Graphics ‡ No
Graphics Output None
Intel® Clear Video Technology No
Macrovision* License Required No
Expansion Options
PCI Express Revision 1.1
Package Specifications
Max CPU Configuration 1
TCASE 110°C
Package Size 37.5mm x 37.5mm
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Fast Memory Access No
Intel® Flex Memory Access No
SPECIFICATIONS--------------------------------
Mobile Intel® 852PM Chipset-------------------------------
(Intel® 82852PM Memory Controller)--------
----------------
SPECIFICATIONS--------------below------------------------------------
Mobile Intel® 852GMV Chipset----------------------------------------
(Intel® 82852GMV Graphics and Memory Controller)-------
---------------------
Essentials
Status End of Life
Supported FSBs 533MHz
FSB Parity No
Embedded Options Available No
Max TDP 3.2 W
Recommended Customer Price N/A
Memory Specifications
Max Memory Size (dependent on memory type) 2 GB
Memory Types DDR-200 / DDR-266
# of Memory Channels 1
Max Memory Bandwidth 2.1 GB/s
Physical Address Extensions 32-bit
ECC Memory Supported ‡ No
Graphics Specifications
Integrated Graphics ‡ Yes
Graphics Output VGA, LVDS, DVO
Intel® Clear Video Technology No
Macrovision* License Required No
Expansion Options
PCI Express Revision 1.1
Package Specifications
Max CPU Configuration 1
Package Size 37.5mm x 37.5mm
Low Halogen Options Available See MDDS
Advanced Technologies
Intel® Fast Memory Access No
Intel® Flex Memory Access No
SPECIFICATIONS--------------------------------------------------
Mobile Intel® 852GMV Chipset----------------------------------------
(Intel® 82852GMV Graphics and Memory Controller)-------
---------------------
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