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Date:      Thu, 22 Jun 2017 18:26:41 +0000
From:      bugzilla-noreply@freebsd.org
To:        freebsd-toolchain@FreeBSD.org
Subject:   [Bug 220184] clang 4.0.0 segfaults on buildworld
Message-ID:  <bug-220184-29464-NIsOrC5dzL@https.bugs.freebsd.org/bugzilla/>
In-Reply-To: <bug-220184-29464@https.bugs.freebsd.org/bugzilla/>
References:  <bug-220184-29464@https.bugs.freebsd.org/bugzilla/>

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https://bugs.freebsd.org/bugzilla/show_bug.cgi?id=3D220184

O. Hartmann <ohartmann@walstatt.org> changed:

           What    |Removed                     |Added
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                 CC|                            |ohartmann@walstatt.org

--- Comment #9 from O. Hartmann <ohartmann@walstatt.org> ---
In the past I saw similar segfaults and after all memory tests have passed
successfully, I realised that the CPU temperature arose dramatically and the
dissipation capacity of the cooler has been insufficient.

Since LLVM/CLANG 4.0.0 is in the tree, I realise a dramatic temperature
increase on my Lenovo ThinkPad Edge E540, which is equipted with a Intel
i5-4200M. The temperature is something I observe very carefully. this might=
 be
o coincidence, but I have the imagination that compiler developers try to u=
se
the facilities a CPU provides to speed up compilation, so the performance i=
s in
relation to power consumption and therefore heat dissipation.

On the other hand, I ripped off the CPU cooler and applied high quality the=
rmal
grease - and that dropped the CPU temperature from ~ 81 degree Celsius down=
 to
66 - 72 degree Celsius within the same environment temperature and roughly =
the
same OS revision (I did the grease application within one day and recompile=
d a
complete world from scratch, again).

So, to make it short: check the grease and thermal conductivity of your CPU
cooler. Thermal grease is not long-term stable, the same is for thermal pad=
s.
They get brittle and loose thermal conductivity capabilities over several y=
ears
of use, and faster when the CPU is stressed by overclocking.

--=20
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