Date: Thu, 22 Jun 2017 18:26:41 +0000 From: bugzilla-noreply@freebsd.org To: freebsd-toolchain@FreeBSD.org Subject: [Bug 220184] clang 4.0.0 segfaults on buildworld Message-ID: <bug-220184-29464-NIsOrC5dzL@https.bugs.freebsd.org/bugzilla/> In-Reply-To: <bug-220184-29464@https.bugs.freebsd.org/bugzilla/>
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https://bugs.freebsd.org/bugzilla/show_bug.cgi?id=220184 O. Hartmann <ohartmann@walstatt.org> changed: What |Removed |Added ---------------------------------------------------------------------------- CC| |ohartmann@walstatt.org --- Comment #9 from O. Hartmann <ohartmann@walstatt.org> --- In the past I saw similar segfaults and after all memory tests have passed successfully, I realised that the CPU temperature arose dramatically and the dissipation capacity of the cooler has been insufficient. Since LLVM/CLANG 4.0.0 is in the tree, I realise a dramatic temperature increase on my Lenovo ThinkPad Edge E540, which is equipted with a Intel i5-4200M. The temperature is something I observe very carefully. this might be o coincidence, but I have the imagination that compiler developers try to use the facilities a CPU provides to speed up compilation, so the performance is in relation to power consumption and therefore heat dissipation. On the other hand, I ripped off the CPU cooler and applied high quality thermal grease - and that dropped the CPU temperature from ~ 81 degree Celsius down to 66 - 72 degree Celsius within the same environment temperature and roughly the same OS revision (I did the grease application within one day and recompiled a complete world from scratch, again). So, to make it short: check the grease and thermal conductivity of your CPU cooler. Thermal grease is not long-term stable, the same is for thermal pads. They get brittle and loose thermal conductivity capabilities over several years of use, and faster when the CPU is stressed by overclocking. -- You are receiving this mail because: You are the assignee for the bug.home | help
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